This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that worldwide motherboard application IC market volume continued to drop in the first quarter of 2010. It is forecasted that the market volume will continue to suffer from year-on-year and sequential declines in the second quarter of 2010, while the third-quarter market volume is expected to rebound and see sequential growth.